🔌 COPPER
Copper Forging: C101, C110 and Tellurium Copper
Copper forges, but the reason you forge it is almost always electrical or thermal, not structural. The grades that matter are chosen for conductivity to four significant figures, and the forging process exists to put dense, void-free, high-conductivity metal into a shape that machining from rod cannot reach economically. Oxygen content, not strength, drives the grade decision.
Hot Forging, Hot Shortness and Cold Coining
Pure copper hot forges in roughly the 1400-1650°F range and flows beautifully because it is extremely ductile. The risk is hot shortness from impurities, particularly trace lead, bismuth or sulfur, which form low-melting grain-boundary films and cause the part to crumble or crack at forging heat. This is exactly why high-purity, controlled-chemistry stock (C101/C110) is used and why scrap or uncertified copper is dangerous to forge. Because copper is so soft and ductile, much copper shaping is actually done cold or warm: cold heading, cold coining and impact extrusion produce contacts, terminals and rivets at high speed with excellent surface finish and work-hardened strength. Cold work raises hardness and tensile strength substantially but lowers conductivity slightly and the part may need a stress-relief or full anneal afterward to restore ductility and conductivity. So the process choice is really hot forge for larger near-net shapes versus cold form for small high-volume parts. Copper galls and sticks to dies as readily as it conducts, so lubrication matters, and its high thermal conductivity means a hot billet dumps heat into cold dies fast, chilling the surface. Heated dies or fast forging cycles help. The upside is that forged or cold-worked copper is fully dense with no porosity, which matters enormously for high-current and high-vacuum parts where a single void is a failure.
Where Forged Copper Is Worth the Trouble
The applications that justify forging copper rather than machining it are almost all electrical and thermal. High-current bus bars, switchgear contacts, electrode holders, welding tips, induction-heating components and waveguide parts are forged in C101 and C110 because forging delivers the full-density, high-conductivity, net-or-near-net shape that a machined-from-plate part would waste expensive copper to achieve. Tellurium copper enters here as the machinable option: a small tellurium addition gives near-free-machining behavior while keeping 90-95% IACS, so parts that are forged near-net and then heavily machined use C145 tellurium copper to keep the secondary machining cheap. Semiconductor and vacuum applications drive demand for OFHC C101 specifically, because oxygen-free copper is required for high-vacuum brazing and outgassing-sensitive components. The forging gives a homogeneous, void-free blank that brazes leak-tight. Thermal-management parts, heat sinks and high-power-electronics baseplates use forged copper where conductivity must be maximized and casting porosity would create thermal hot spots. In all of these, the value is in conductivity-per-shape, and forging is justified when the geometry plus volume make machining from solid copper wasteful, since copper stock is expensive and chips, while recyclable, represent real lost value.
Frequently Asked Questions
Last updated: July 2026
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